SEMICONDUCTOR INSPECTING APPARATUS, SEMICONDUCTOR DEFECT ANALYZER, SEMICONDUCTOR DESIGN DATA CORRECTING APPARATUS, SEMICONDUCTOR INSPECTION METHOD, SEMICONDUCTOR DEFECT ANALYZING METHOD, SEMICONDUCTOR DESIGN DATA CORRECTING METHOD, AND COMPUTE-READABLE RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To accurately and quantify defects with high efficiency that are generated in a semiconductor device, depending on the features of design. ;SOLUTION: By using a substrate inspecting device 1, that has a design data processing part 19, a statistics processing and neural network processing part 21, an inspection region sampling part 23, and a numerical calculation 25, a region to be inspected is extracted from design data and is divided by a lattice with an arbitrary size for creating a lattice region, the features of design are digitalized for each lattice region for creating design feature item data, the design feature item data is classified into a desired number of groups for creating feature classification data, the lattice region is extracted randomly from the feature classification data at a fixed sampling rate to the number of lattice regions belonging to each group, and furthermore the number of defects in the entire region to be inspected is calculated, based on data regarding actual defects obtained by inspecting a machined pattern, based on the design data, the feature classification data and the sampling rate.;COPYRIGHT: (C)2001,JPO