首页> 外国专利> SEMICONDUCTOR INSPECTING SYSTEM, SEMICONDUCTOR DEFECT ANALYZING SYSTEM, SEMICONDUCTOR DESIGN DATA MODIFYING SYSTEM, SEMICONDUCTOR INSPECTING METHOD, SEMICONDUCTOR DEFECT ANALYZING METHOD, SEMICONDUCTOR DESIGN DATA MODIFYING METHOD, AND COMPUTER READABLE RECORDED MEDIUM

SEMICONDUCTOR INSPECTING SYSTEM, SEMICONDUCTOR DEFECT ANALYZING SYSTEM, SEMICONDUCTOR DESIGN DATA MODIFYING SYSTEM, SEMICONDUCTOR INSPECTING METHOD, SEMICONDUCTOR DEFECT ANALYZING METHOD, SEMICONDUCTOR DESIGN DATA MODIFYING METHOD, AND COMPUTER READABLE RECORDED MEDIUM

机译:半导体检查系统,半导体缺陷分析系统,半导体设计数据修改系统,半导体检查方法,半导体缺陷分析方法,半导体设计数据修改方法以及计算机可读记录

摘要

A semiconductor inspecting system extracts a region to be inspected from a design data of a semiconductor device and divides the region by a lattice to prepare lattice regions; derives a numerical value indicative of a design characteristic of the design data every one of the lattice regions to prepare a design characteristic item data; prepares a characteristic classification data by classifying the design characteristic item data into a desired number of groups; extracts the lattice regions at random from the characteristic classification data at a constant sampling rate; acquires a defect inspection data by actually inspecting a pattern of the extracted lattice regions processed on the basis of the design data; and calculates the number of defects in the whole region to be inspected on the basis of the defect inspection data, the characteristic classification data and the sampling rate.
机译:半导体检查系统从半导体器件的设计数据中提取要检查的区域,并用晶格划分该区域以准备晶格区域。导出指示每个格子区域的设计数据的设计特征的数值,以准备设计特征项目数据;通过将设计特征项目数据分类为期望数量的组来准备特征分类数据;以恒定的采样率从特征分类数据中随机抽取晶格区域;通过实际检查基于设计数据处理的提取出的格子区域的图案来获取缺陷检查数据;根据缺陷检查数据,特征分类数据和采样率,计算出整个待检查区域的缺陷数。

著录项

  • 公开/公告号US6748571B2

    专利类型

  • 公开/公告日2004-06-08

    原文格式PDF

  • 申请/专利权人 KABUSHIKI KAISHA TOSHIBA;

    申请/专利号US20030409205

  • 发明设计人 TADASHI MIWA;

    申请日2003-04-09

  • 分类号G06F175/00;

  • 国家 US

  • 入库时间 2022-08-21 23:14:46

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