Void formation monitoring method for damascene structures, involves forming and cutting test structures then inspecting cross-sectional view and investigating void formation in damascene structure

摘要

The method involves forming test structures with two damascene structures that differ in their cross-sectional geometric parameter value. The test structures are cut to expose a cross-sectional view to both the damascene structures. The views are inspected and the void formation in each of the structure is investigated. Independent claims are also included for the following (a) computer readable storage medium (b) an integrated circuit chip with semiconductor circuit