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Method and system using power modulation and velocity modulation producing sputtered thin films with sub-angstrom thickness uniformity or custom thickness gradients

机译:使用功率调制和速度调制的方法和系统产生具有亚埃厚度均匀性或自定义厚度梯度的溅射薄膜

摘要

A method and system for determining a source flux modulation recipe for achieving a selected thickness profile of a film to be deposited (e.g., with highly uniform or highly accurate custom graded thickness) over a flat or curved substrate (such as concave or convex optics) by exposing the substrate to a vapor deposition source operated with time-varying flux distribution as a function of time. Preferably, the source is operated with time-varying power applied thereto during each sweep of the substrate to achieve the time-varying flux distribution as a function of time. Preferably, the method includes the steps of measuring the source flux distribution (using a test piece held stationary while exposed to the source with the source operated at each of a number of different applied power levels), calculating a set of predicted film thickness profiles, each film thickness profile assuming the measured flux distribution and a different one of a set of source flux modulation recipes, and determining from the predicted film thickness profiles a source flux modulation recipe which is adequate to achieve a predetermined thickness profile. Aspects of the invention include a computer-implemented method employing a graphical user interface to facilitate convenient selection of an optimal or nearly optimal source flux modulation recipe to achieve a desired thickness profile on a substrate. The method enables precise modulation of the deposition flux to which a substrate is exposed to provide a desired coating thickness distribution.
机译:用于确定源通量调制配方的方法和系统,以实现在平坦或弯曲的基板(例如凹面或凸面光学器件)上要沉积的薄膜的选定厚度分布(例如,具有高度均匀或高度精确的定制渐变厚度)通过将衬底暴露于以随时间变化的随时间变化的通量分布运行的气相沉积源。优选地,在基板的每次扫掠期间以施加有时变功率的源来操作源,以实现随时间变化的时变通量分布。优选地,该方法包括以下步骤:测量源通量分布(使用在暴露于源的情况下保持静止的测试件,并且源在多个不同的施加功率水平中的每一个下操作),计算一组预测的膜厚分布,每个膜厚度轮廓都假设测量的通量分布和一组源通量调制配方中的一个不同,并根据预测的膜厚轮廓确定足以实现预定厚度轮廓的源通量调制配方。本发明的方面包括一种计算机实施的方法,其采用图形用户界面来促进方便地选择最佳或接近最佳的源通量调制配方,以在基板上实现期望的厚度分布。该方法能够精确地调节基底所暴露于的沉积通量,以提供期望的涂层厚度分布。

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