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Influence of baffle on improving the thickness uniformity of thin film deposited by magnetron sputtering system

机译:挡板对改善磁控溅射系统沉积薄膜厚度均匀性的影响

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The way of improving the thickness uniformity of the thin film deposited by magnetron sputtering system is presented in this paper. A simple model for the magnetron sputtering system with a baffle between cathode target and substrate is described. Based on this model, it is possible to predict the relative deviation of film thickness with this baffle-model by taking the shape and size of baffle into the consideration. The purpose of this article is to explain how different baffle parameters affect the uniformity of thin film using the method of finite element with rectangle target in this magnetron system. It is found that there may exist optimum baffle conditions where the relative deviation of thin film thickness is less than 3 % with a diameter of 0 150 mm substrate.
机译:提出了提高磁控溅射系统沉积薄膜厚度均匀性的方法。描述了在阴极靶和衬底之间具有挡板的磁控溅射系统的简单模型。基于该模型,可以通过考虑挡板的形状和尺寸来预测该挡板模型的膜厚度的相对偏差。本文的目的是在此磁控管系统中使用矩形靶的有限元方法来解释不同的挡板参数如何影响薄膜的均匀性。已经发现,在基板直径为0 150 mm的情况下,可能存在最佳的挡板条件,其中薄膜厚度的相对偏差小于3%。

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