Interconnect test structure with slotted feeder lines to prevent stress-induced voids

摘要

An interconnect test structure for characterizing electromigration includes a test line and a feeder coupled to the test line by a via structure. A width of the feeder line is greater than a width of the test line. Slots are formed in the feeder line for preventing formation of a stress-induced void at an interface between the feeder line and the via structure. Thus, an increase in resistance of the test structure is attributable to electromigration failure of the test line.