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Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device

机译:带有嵌入式电子装置的印刷线路板和制造带有嵌入式电子装置的印刷线路板的方法

摘要

A printed wiring board (100) having an embedded electric device (41) is manufactured as follows. A first resin film (23) having an opening (35) or a sheet member (81) having a recess (82) is piled with a plurality of second resin films (23), on which a plurality of conductive layers (22) are formed. The first and second resin films (23) and the sheet member (81) include thermoplastic resin. An electric device (41) is inserted in the opening (35) or the recess. Then, the piled body including the electric device (41) is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes (42) of the electric device (41) are electrically connected to the conductive layers (22) while the first and second resin films (23) and the sheet member (81) plastically deformed to seal the electric device (41). IMAGE IMAGE IMAGE
机译:具有嵌入式电气装置(41)的印刷线路板(100)如下制造。在具有开口(35)的第一树脂膜(23)或具有凹部(82)的片状构件(81)上堆叠有多个第二树脂膜(23),在第二树脂膜上形成有多个导电层(22)。形成。第一和第二树脂膜(23)和片状构件(81)包括热塑性树脂。电气设备(41)插入开口(35)或凹槽中。然后,对具有电气设备(41)的堆积体进行加压并加热而使其一体化。当对叠层体进行加压加热时,电气设备(41)的多个电极(42)与第一树脂膜(23)和第二树脂膜(23)以及片状部件(81)电连接。塑性变形以密封电气设备(41)。 <图像> <图像> <图像>

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