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Electrical properties of printed wiring boards. Electrical properties of Sandia/Bendix Standard Process printed wiring boards

机译：印刷配线板的电气性能。 Sandia / Bendix标准工艺印花电路板的电气特性

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作者
C.W. Jennings;
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年度 1976
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原文格式 PDF
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1. Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE) [J] . Daniel Savi, Ueli Kasser, Thomas Ott Waste Management . 2013,第12期

机译：废弃电子电气设备（WEEE）中电容器，电池和印刷线路板的污染基准
2. Evaluation of Dielectric Properties of Printed Wiring Board Materials by Using a Microstrip-ring and Strip-line Ring Resonator Methods [J] . Heinola J.-M., Strom J.-P. IEEE Electrical Insulation Magazine . 2007,第3期

机译：用微带环和带状线谐振器方法评估印刷线路板材料的介电性能
3. Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards [J] . J. Lee, C. S. Cho, J. E. Morris Microsystem Technologies . 2009,第1期

机译：浸银印刷电路板上各向同性导电胶的电学和可靠性
4. Electrical and Reliability Properties of Isotropic Conductive Adhesives (ICAs) on Immersion Silver Printed Wiring Boards (PWBs) [C] . Jeahuck Lee, C.S. Cho, James E. Morris 2007 international conference on electronic materials and packaging . 2007

机译：浸银印刷线路板（PWB）上各向同性导电胶（ICAs）的电气和可靠性特性
5. Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards. [D] . Fu, Chia-Yu. 1999

机译：内部状态变量模型在印刷线路板的热加工和电镀通孔的可靠性中的应用。
6. A comparison of gold vs silver electrode contacts for high-resolution gastric electrical mapping using flexible printed circuit board arrays [O] . G O’Grady, N Paskaranandavadivel, T R Angeli, -1

机译：使用柔性印刷电路板阵列对高分辨率胃电电极贴搏的金VS银电极触点的比较
7. Sandia/Bendix standard process capability study of printed wiring boards [O] . J.L. Wilson, C.W. Jennings 1976

机译：桑迪亚/林杉标准工艺电容研究印刷线路板

Electrical properties of printed wiring boards. Electrical properties of Sandia/Bendix Standard Process printed wiring boards

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