CONDUCTIVE PARTICLE DISPERSION COMPOSITION, CONDUCTIVE PASTE AND PRINTED WIRING BOARD USING THE SAME, AND METHOD FOR MANUFACTURING CONDUCTIVE PARTICLE DISPERSION COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a conductive particle dispersion composition that is excellent in dispersion stability of conductive particles and allows formation of a homogeneous and high-conductivity hardened material, a method for manufacturing the conductive particle dispersion composition by a simple process, and a printed wiring board having a homogeneous and high-conductivity conductive layer.;SOLUTION: The conductive particle dispersion composition includes each component shown in the following (A)-(C). The conductive particle dispersion composition is used in conductive paste, conductive ink, and printed wiring boards. The manufacturing method is used for manufacturing the conductive particle dispersion composition. (A) A conductive particle configured such that an average particle size obtained by particle sizing using a dynamic light scattering method is 0.02-20 μm and a content on the basis of the total mass of a nonvolatile component included in the conductive particle dispersion composition is 30-95 mass% (B) A hardening compound having a functional group that forms an interaction with the conductive particle. (C) A solvent.;COPYRIGHT: (C)2009,JPO&INPIT