A New Interconnection Technique Using Conductive Paste for Multi-Layered Printed Wiring Board

摘要

A New Interconnection Technique Using Conductive Paste for Multi-Layered Printed Wiring Board. To satisfy increasing requirements for multi-layered printed wiring board (ML-PWB), we have already reported a new type with any layer IVH structure, dubbed "ALIVH~TM" (Any Layer Inner Via Hole ML-PWB). This any layer IVH structure enables us to make electrical interconnection between any two layers of the board, so offers benefits of down-sizing, components mounting capability, shorter wiring length for high speed/high frequency circuit applications and ease of automatic designing.