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ELECTROLESS TIN OR TIN ALLOY PLATING LIQUID AND ELECTRONIC PARTS ON WHICH TIN OR TIN ALLOY COATED FILM IS FORMED BY USING THE PLATING LIQUID
ELECTROLESS TIN OR TIN ALLOY PLATING LIQUID AND ELECTRONIC PARTS ON WHICH TIN OR TIN ALLOY COATED FILM IS FORMED BY USING THE PLATING LIQUID
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机译:锡或锡合金镀膜上的无锡锡或锡合金镀液和电子零件是通过使用镀液制成的
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摘要
PROBLEM TO BE SOLVED: To provide an electroless tin or tin alloy plating liquid for forming a plating coated film which hardly causes infiltration of plating liquid into the interface between a coverlay film or solder resist and copper or copper alloy, has satisfactory solder wetting property and has preferable bonding reliability between base material and solder.;SOLUTION: The electroless tin or tin alloy plating liquid comprises at least a tin salt, a complexing agent and an acid, and further contains: a compound having one or more hydroxyl groups directly bound to a benzene ring; and a polyalkylene glycol compound or a polyalkylene glycol-ether compound prepared by blocking one or more hydroxyl groups of terminals of polyalkylene glycol with alkoxy group.;COPYRIGHT: (C)2011,JPO&INPIT
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