ELECTROLESS TIN OR TIN-ALLOY PLATING SOLUTION AND ELECTRONIC PART WITH TIN OR TIN-ALLOY COATING FILM FORMED FROM THE PLATING SOLUTION

摘要

An electroless tin or tin-alloy plating solution which is less apt to penetrate into the interface between a cover lay film or solder resist and copper or a copper alloy, and can form a deposit film having satisfactory wettability by a solder and satisfactory reliability of connection between the base and the solder.The electroless tin or tin-alloy plating solution contains at least a tin salt, a complexing agent, and an acid, and is characterized by containing an azole compound or azine compound having three or more nitrogen atoms in the ring.