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METHOD FOR FABRICATING A SOLUTION-BASED CONDUCTIVE FILM, CAPABLE OF ENHANCING CONDUCTIVITY THROUGH THERMAL ANNEALING CONTROL AFTER FORMING A CONDUCTIVE PATTER USING A METAL-BASED LIQUEFIED MATERIAL
METHOD FOR FABRICATING A SOLUTION-BASED CONDUCTIVE FILM, CAPABLE OF ENHANCING CONDUCTIVITY THROUGH THERMAL ANNEALING CONTROL AFTER FORMING A CONDUCTIVE PATTER USING A METAL-BASED LIQUEFIED MATERIAL
PURPOSE: A method for fabricating a solution-based conductive film is provided to enable a metal material having excellent conductivity to be applied to a process for forming a pattern and to obtain superior conductivity at a low temperature through thermal treatment of a metal film.;CONSTITUTION: A method for fabricating a solution-based conductive film comprises the following steps: forming the conductive film using a metal solution including a metal precursor; and enhancing conductivity by performing thermal treatment while supplying carboxylic acid vapor to the conductive film and reducing a metal oxide component, which is included in the precursor, into metal. Carrier gas and the carboxylic acid vapor are supplied to the conductive film. The metal solution includes metal nanoparticles, metal oxide nanoparticles, metal nanoparticles having a core/shell structure, or a metal-organic complex.;COPYRIGHT KIPO 2011
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