THERMOSETTING SILICONE COMPOSITION FOR A LIGHT EMITTING DIODE ENCAPSULANT WITH STRONG MECHANICAL PROPERTIES, LOW LINEAR EXPANSION COEFFICIENT, AND HIGH ADHESIVE PROPERTY BY COMPRISING A SILICON RESIN INCLUDING AN ORGANIC GROUP AS A BASE MATERIAL

摘要

PURPOSE: A thermosetting silicone composition is provided to secure strong mechanical properties and high adhesive property without use of filler lowering optical tansmissivity, and to maintain the shape of the thermosetting silicone composition even in an additional heat process and the continued exposition to the heat. ;CONSTITUTION: A thermosetting silicone composition for a light emitting diode encapsulant comprises (a) a silicone resin including an organic group including at least two carbon-carbon double bonds, (b) a hardener including at least two hydrogens bonded to the silicon atoms, (c) additional reaction catalysts, (d) alcohols including a carbon-carbon triple bond, and (e) organic additives including an ester group. The linear expansion coefficient is 100-300 ppm/K.;COPYRIGHT KIPO 2011