Thermal expansion regulator, use as a thermal expansion regulator, thermosetting resin composition, insulating material containing the thermosetting resin composition, sealant and conductive paste, thermosetting resin composition Cured cured product, substrate material having the thermosetting resin composition, prepreg impregnated with the thermosetting resin composition in a base material, member obtained by curing the thermosetting resin composition of the prepreg, heat Method of adjusting expansion coefficient, and member manufactured using the adjusting method

摘要

As a thermal expansion adjusting agent that can reduce the linear thermal expansion coefficient of a cured product of a thermosetting resin composition used for an insulating resin layer and the like that is effective for suppressing deformation of a circuit board due to heating, the following formula ( A thermal expansion regulator containing the glycoluril derivative compound of 1) is provided, and the linear thermal expansion coefficient of a cured product obtained by curing the thermosetting resin composition is blended with the thermal expansion regulator described above. Since it can be made low, a member with small deformation due to heat can be provided. [Chemical 1]