Thermo and Dynamic Mechanical Properties of the High Refractive Index Silicone Resin for Light Emitting Diode Packaging

摘要

This paper studies the silicone based materials used for light emitting diode (LED) packaging. A phenyl vinyl silicone resin (PVS) with high refractive index was synthesized in this paper. Four types of packaging materials were prepared by a hydrosilylation reaction between PVS and hydride silicone materials. This study focuses on the thermo and dynamic mechanical properties of the packaging materials. The effect of hardness, coefficient of thermal expansion, moduli, loss factors, and glass transition temperature (Tg) of these materials on their reliability with LED are discussed in this paper. Furthermore, the internal stresses were calculated and the characteristics of the above-mentioned properties were used to explore the reasons of LED failure modes and how to further increase the reliability of LED. In addition, it is helpful for the selection of silicone materials used in LED packaging.