IC tag adhesive body, peeling sheet with IC tag adhesive body, peeling sheet for material with IC tag adhesive body, winding body of the IC tag adhesive-body material, manufacturing method of the release sheet with IC tag adhesive body, peeling with IC tag adhesive body method of manufacturing a sheet for the material, method of manufacturing the winding body of the IC tag adhesive-body material, adhesive interposer body, peeling sheet, peeling sheet for material with adhesive interposer body with adhesive interposer body, winding body of the interposer adhesive-body material, interposer method of producing a pressure-sensitive adhesive body with a release sheet, interposer method of producing a pressure-sensitive adhesive body with a release sheet for the material, and a method of manufacturing a winding body of the interposer adhesive-body material

摘要

PROBLEM TO BE SOLVED: To reduce various faults resulting from projection of an IC chip.;SOLUTION: The peeling sheet 14 with an IC tag adhesive body is equipped with an IC tag 10 having a base 30, an antenna 34 formed on the base and the IC chip 32 electrically connected to the antenna 34, a peeling sheet 45 to at least one surface 46 of which peeling processing is performed and an adhesive layer 40 provided between the surface 46 to which the peeling processing performed of the peeling sheet 45 and the IC tag 10. The IC chip of the IC tag projects from the base and an adhesive layer is provided on a plane on the side where the IC chip of the IC tag projects. Through holes for accepting the projected IC chip of the IC tag are formed on the peeling sheet and the adhesive layer.;COPYRIGHT: (C)2007,JPO&INPIT