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WAFER PROCESSING APPARATUS HAVING IMPROVED WAFER MAPPING FUNCTION AND METHOD FOR MAPPING WAFER
WAFER PROCESSING APPARATUS HAVING IMPROVED WAFER MAPPING FUNCTION AND METHOD FOR MAPPING WAFER
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机译:具有改进的晶圆映射功能的晶圆加工设备和映射晶圆的方法
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摘要
PURPOSE: there is the chip figure method for arranging of chip graphical layout function to be provided to the abnormal chip of Precision Mapping and increase its reliability chip figure placement process for chip processing device. ;A kind of CONSTITUTION: FOUP (bladder sesame is unified in open front) (50) load phase (120). Door (130) and open cell (114). A kind of mapping sensor raising and lowering with the door. The chip for the excircle that the mapping sensor illumination is mapped to. The mapping sensor, which receives, comes from chip. ;The 2013 of copyright KIPO submissions
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