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High voltage lateral double-diffused metal oxide semiconductor field effect transistor (LDMOSFET) having a deep fully depleted drain drift region

机译:具有深的全耗尽漏极漂移区的高压横向双扩散金属氧化物半导体场效应晶体管(LDMOSFET)

摘要

Disclosed are semiconductor structures. Each semiconductor structure can comprise a substrate and at least one laterally double-diffused metal oxide semiconductor field effect transistor (LDMOSFET) on the substrate. Each LDMOSFET can have a fully-depleted deep drain drift region (i.e., a fully depleted deep ballast resistor region) for providing a relatively high blocking voltage. Different configurations for the drain drift regions are disclosed and these different configurations can also vary as a function of the conductivity type of the LDMOSFET. Additionally, each semiconductor structure can comprise an isolation band positioned below the LDMOSFET and an isolation well positioned laterally around the LDMOSFET and extending vertically to the isolation band such that the LDMOSFET is electrically isolated from both a lower portion of the substrate and any adjacent devices on the substrate.
机译:公开了半导体结构。每个半导体结构可以包括衬底和在衬底上的至少一个横向双扩散金属氧化物半导体场效应晶体管(LDMOSFET)。每个LDMOSFET可以具有完全耗尽的深漏极漂移区域(即,完全耗尽的深镇流电阻器区域),以提供相对较高的阻断电压。公开了用于漏极漂移区的不同配置,并且这些不同的配置也可以根据LDMOSFET的导电类型而变化。另外,每个半导体结构可以包括位于LDMOSFET下方的隔离带和位于LDMOSFET周围横向并垂直延伸至隔离带的隔离井,以使LDMOSFET与衬底的下部以及其上的任何相邻器件电隔离。基板。

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