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JOINT EXAMINATION DEVICE, JOINING DEVICE, AND JOINT EXAMINATION METHOD

机译:联合考试装置,联合装置和联合考试方法

摘要

This joint examination device (11), which examines the joining state of a joined structure obtained by joining a metal member (2, 2') and a resin member (3, 3') at a joining area (BF, BF'), is provided with: a temperature measurement means (14) for measuring the temperature of the metal member (2, 2'); and a determination means (15) which, in cases when the actually measured temperature measured by the temperature measurement means (14) is within a preset reference temperature range in which the joining state between the metal member (2, 2') and the resin member (3, 3') is normal, determines that the joining state is satisfactory.
机译:该接头检查装置(11)检查通过在接合区域(BF,BF')接合金属构件(2、2')和树脂构件(3、3')而获得的接合结构的接合状态,设有:温度测量装置(14),用于测量金属构件(2、2')的温度;以及确定装置(15),当温度测量装置(14)测量的实际测量温度处于金属材料(2、2')和树脂之间的结合状态的预设参考温度范围内时部件(3、3')正常,确定连接状态令人满意。

著录项

  • 公开/公告号WO2016140098A1

    专利类型

  • 公开/公告日2016-09-09

    原文格式PDF

  • 申请/专利权人 OMRON CORPORATION;

    申请/专利号WO2016JP55102

  • 发明设计人 NISHIKAWA KAZUYOSHI;

    申请日2016-02-22

  • 分类号B23K31;B23K26;B23K26/08;B23K26/402;B23K26/57;B29C65/16;B29C65/82;

  • 国家 WO

  • 入库时间 2022-08-21 14:16:43

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