Method for forming plated through hole having high aspect ratio and method for removing stub in printed circuit board with high accuracy

摘要

The present invention relates to a printed circuit board (PCB), and more particularly to a method for forming a through hole having a high aspect ratio and a method for removing a stub in a PCB with high accuracy. A highly accurate stub removal method can be used to remove long and short stubs. In these methods, a plurality of holes having various diameters and depths are drilled from the upper surface and / or the lower surface of the printed circuit board using drills having different diameters. [Selection] Figure 10G