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ITO sputtering target, method for producing the same, ITO transparent conductive film, and method for producing ITO transparent conductive film

机译:ITO溅射靶,其制造方法,ITO透明导电膜以及ITO透明导电膜的制造方法

摘要

A sintered body composed of In, Sn, O, and inevitable impurities, and Sn / (In + Sn) is 1.8% or more and 3.7% or less (except 3.7%) by atomic ratio. Sn is contained, the average crystal grain size of the sintered body is in the range of 1.0 to 5.0 μm, the pores having a major axis diameter of 0.1 to 1.0 μm are 0.5% or less in area ratio, It consists of two phases, an indium oxide phase and a tin oxide rich phase. The area ratio of the tin oxide rich phase is 0.1 to 1.0% or less, and 95% or more of the tin oxide rich phase is present at the grain boundary triple point. The present invention relates to a sputtering target. It is an ITO sputtering target having a low tin oxide composition suitable for forming a transparent conductive film and capable of obtaining a low resistance film even at a low temperature. The target has a small particle size, high density, high strength, arcing and A sputtering target capable of reducing nodules can be provided.
机译:由In,Sn,O和不可避免的杂质以及Sn /(In + Sn)组成的烧结体的原子比为1.8%以上且3.7%以下(3.7%除外)。含有Sn,烧结体的平均结晶粒径为1.0〜5.0μm的范围,长径为0.1〜1.0μm的细孔的面积率为0.5%以下,由两相构成,氧化铟相和富氧化锡相。富氧化锡相的面积比为0.1〜1.0%以下,且在晶界三相点存在95%以上的富氧化锡相。溅射靶技术领域本发明涉及溅射靶。它是具有适合于形成透明导电膜的,具有低氧化锡组成的ITO溅射靶,并且即使在低温下也能够获得低电阻膜。该靶具有小粒径,高密度,高强度,电弧和电弧。可以提供能够减少结核的溅射靶。

著录项

  • 公开/公告号JPWO2016072441A1

    专利类型

  • 公开/公告日2017-04-27

    原文格式PDF

  • 申请/专利权人 JX金属株式会社;

    申请/专利号JP20160557791

  • 发明设计人 掛野 崇;

    申请日2015-11-05

  • 分类号C23C14/34;C23C14/08;C04B35/01;H01B5/14;H01B13;

  • 国家 JP

  • 入库时间 2022-08-21 13:53:32

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