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Electroless tin or tin alloy plating solution and electronic components using the plating solution to form a tin or tin alloy coating
Electroless tin or tin alloy plating solution and electronic components using the plating solution to form a tin or tin alloy coating
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机译:化学镀锡或锡合金镀层溶液以及使用镀层溶液形成锡或锡合金镀层的电子元件
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摘要
The cover ray film and the solder resist and penetration of the plated liquid to the copper or copper alloy surface is little, in addition, solder wettability satisfactory, non electrolytic tin or the tin alloy plated liquid whose it is possible junction reliability of the backing material and the solder to form satisfactory plated coat, is offered. At least it is non electrolytic tin or the tin alloy plated liquid which features that azole chemical compound or the azine compound which the nitrogen atom three or more is included is contained inside ring the tin salt, in non electrolytic tin or the tin alloy plated liquid which includes the complexing agent and the Acid.
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