首页> 美国政府科技报告 >Chromium/Molybdenum Alloy Plating. Part 1: The Electrodeposition of Low Contraction Chromium/Molybdenum Alloys Using Unipolar (On/Off) Pulse Plating.
【24h】

Chromium/Molybdenum Alloy Plating. Part 1: The Electrodeposition of Low Contraction Chromium/Molybdenum Alloys Using Unipolar (On/Off) Pulse Plating.

机译:铬/钼合金电镀。第1部分:使用单极(开/关)脉冲电镀电沉积低收缩铬/钼合金。

获取原文

摘要

The microstructure and mechanical properties of a pulse-plated low contraction (LC) chromium/molybdenum (Cr/Mo) alloy deposit were evaluated and compared to both pulse-plated LC chromium and direct (dc)-plated LC chromium. Molybdenum concentrations as high as approximately 2.4 percent were obtained at a pulsing frequency of 5 Hz (100 ms on-time/100 ms off-time). This represents nearly a 300 percent increase over the percent molybdenum obtained in a dc-plated LC Cr/Mo alloy deposit However, pulse-plated LC Cr/Mo deposits were generally poor in quality with deposits that were frequently cracked and nodular in appearance. Hardness values as high as 900 KHN (50 gm load) were obtained for the pulse-plated LC Cr/Mo alloy. deposit. This hardness represents an 18 percent increase over the maximum reported hardness obtained in a dc-plated LC chromium deposit. The maximum cathode current efficiency (CCE) obtained while pulse plating an LC Cr/Mo alloy was 7.3 percent. This is nearly 52 percent less than the reported CCE obtained when dc plating LC chromium. Chromium/Molybdenum Alloy, Aqueous, Pulse, Electrodeposition.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号