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GaN - SELF-ALIGNED STRUCTURES AND METHODS FOR ASYMMETRIC GAN TRANSISTORS ENHANCEMENT MODE OPERATION

机译:GaN自对准结构和非对称GAN晶体管增强模式操作的方法

摘要

Embodiments include HEMTs (High Electron Mobility Transistors). In embodiments, the gate electrode is spaced apart from the source and drain semiconductor regions by different distances to provide a high breakdown voltage and a low on-state resistance. In embodiments, self-aligning techniques are applied to form a dielectric liner within the trenches and on the mandrel between them, which independently defines the gate length, gate-source length, and gate-drain length in a single masking operation. In embodiments, the III-N HEMTs include fluorine doped semiconductor barrier layers for threshold voltage tuning and / or elevated mode operation.
机译:实施例包括HEMT(高电子迁移率晶体管)。在实施例中,栅电极与源极半导体区域和漏极半导体区域间隔开不同的距离,以提供高击穿电压和低导通电阻。在实施例中,应用自对准技术以在沟槽内以及在它们之间的心轴上形成电介质衬里,其在单个掩膜操作中独立地定义栅极长度,栅极-源极长度和栅极-漏极长度。在实施例中,III-N HEMT包括用于阈值电压调谐和/或升高模式操作的氟掺杂半导体势垒层。

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