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International Microsystems, Packaging, Assembly and Circuits Technology Conference

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1.Improving Throughput of Zero-Kerf Singulation for Ultra-Thin Wafers using Stealth Dicing

机译：使用隐形切块技术提高超薄晶圆的零切口切分能力
- 作者：Natsuki Suzuki;Kazuhiro Atsumi;Naoki Uchiyama;Takayuki Ohba
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Laser beams;
- Throughput;
- Silicon;
- Packaging;
- Radiation effects;
- Laser ablation;
2.Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

机译：原子层沉积与超薄铂中间层低温铜铜准直接键合
- 作者：Kosuke Yamada;Hiroyuki Kuwae;Takumi Kamibayashi;Wataru Momose;Shuichi Shoji;Jun Mizuno
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Bonding;
- Substrates;
- Surface treatment;
- Atomic layer deposition;
- Metals;
- Silicon;
- Integrated circuits;
3.Evaluation of Heat Dissipation Performance of Printed Circuit Board Using JPCA Method in CFD Analysis

机译：JPCA法在CFD分析中评估印刷电路板的散热性能
- 作者：Tomoyuki Hatakeyama;Risako Kibushi;Koichi Suzuki;Masaru Ishizuka
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Thermal resistance;
- Electrical resistance measurement;
- Thermal conductivity;
- Temperature measurement;
- Resistance heating;
4.Advanced Tape Expansion/Assembly Technology for FOWLP and Micro-LED Display

机译：用于FOWLP和Micro-LED显示屏的高级胶带扩展/组装技术
- 作者：T. Fukushima;H. Yonekura;F. Doi;S. Endo;T. Fushimi;K. Yanagimura;M. Koyanagi;T. Tanaka;M. Motoyoshi
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Radiation effects;
- Silicon;
- Tools;
- Universal Serial Bus;
- Light emitting diodes;
- Electrodes;
5.Influence of Applied Power in Microwave Hydrogen Plasma Annealing on Aluminum doped Zinc Oxide/Tin doped Indium Oxide Bilayer Films for Low Emissivity Application

机译：微波氢等离子体退火中施加功率对低发射率应用铝掺杂氧化锌/锡掺杂氧化铟双层薄膜的影响
- 作者：Shang-Chou Chang;Tsung Han Li;Yun-Zen Liao;Yu-Kai Luo;Yi-Lin Shen;Wei-Syuan Syu;Huang-Tian Chan
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Films;
- Plasmas;
- Annealing;
- Hydrogen;
- Resistance;
- Conductivity;
- Glass;
6.The technology for integrating the static, dynamic and capacitance items of electrical testing in power module

机译：在电源模块中集成电气测试的静态，动态和电容项的技术
- 作者：Heng-Lee;Chih-Ming Tzeng;Tao-Chih Chang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Testing;
- Multichip modules;
- Insulated gate bipolar transistors;
- Relays;
- Capacitance;
- Power supplies;
- Reliability;
7.Taguchi DoE for Solder Voids Reduction

机译：Taguchi DoE减少焊锡空洞
- 作者：Ching-Shan Chien;Chien-Wen Chien;Yun-Tsung Li;Hsun-Fa Li
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Ovens;
- Soldering;
- Light emitting diodes;
- Vacuum technology;
- Tin;
- Universal Serial Bus;
- Surface finishing;
8.Formation behavior of intermetallic compound in solder joint assembly within fluxless bonding

机译：无助焊剂中焊点组件中金属间化合物的形成行为
- 作者：Yung-Ta Li;Yuan-Hung Xu;Jiao-Dong Ji;Chang-Fu Lin;C. Key Chung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Soldering;
- Bonding;
- Substrates;
- Intermetallic;
- Compounds;
- Surface finishing;
- Microstructure;
9.Combining Textiles and Electronics: Market Trend and Laundering Testing Challenges of E-Textiles (IMPACT 2018)

机译：纺织品和电子产品的结合：电子纺织品的市场趋势和洗钱测试挑战（IMPACT 2018）
- 作者：Natalia Lo;Cheng Chih Chen;Dem Lee;Leo Yao;Jeffrey Lee
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Monitoring;
- Biomedical monitoring;
- Intelligent sensors;
- Medical services;
- Textiles;
- Reliability;
10.The challenge of Fan-out WLP in different process flow

机译：扇出WLP在不同工艺流程中的挑战
- 作者：Yu-Ting Hsueh;Hong-Da Chang;Wallace Tseng;C. F. Lin;C. Key Chung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Process control;
- Industries;
- Compounds;
- Substrates;
- Curing;
- Integrated circuits;
- Fans;
11.Development of Micrometer-Thick Bonding Material for Wafer-On-Wafer (WOW) Applications

机译：用于晶圆上晶圆（WOW）应用的微米级厚粘结材料的开发
- 作者：N. Araki;Y. S. Kim;S. Kodama;C. Hsiao;H. Chang;C. Lin;T. Ohba
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Curing;
- Adhesives;
- Through-silicon vias;
- Coatings;
- Thermal stability;
- Silicon;
- Stacking;
12.Variation of the Strength and Fracture Mode of a Grain and a Grain Boundary in Polycrystalline Copper Thin Films

机译：多晶铜薄膜中晶粒和晶界的强度和断裂模式的变化
- 作者：Guoxiong Zheng;Yifan Luo;Ken Suzuki;Hideo Miura
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Grain boundaries;
- Copper;
- Stress;
- Integrated circuit interconnections;
- Diffraction;
- Strain;
13.Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures

机译：利用精细的柱状浓度结构开发基于二维石墨烯的高灵敏柔性应变传感器
- 作者：Zhi Wang;Ken Suzuki;Hideo Miura
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Graphene;
- Substrates;
- Pressure sensors;
- Strain;
- Surface treatment;
- Pressure measurement;
- Robot sensing systems;
14.Intelligent Data Acquisition System for MEMS Vibration Monitoring Applications

机译：用于MEMS振动监测应用的智能数据采集系统
- 作者：Tsung-Hsun Wu;Chung-Yang Sue;Pei-Yin Chen
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Vibrations;
- Data acquisition;
- Time-domain analysis;
- Machine tools;
- Frequency-domain analysis;
- Monitoring;
- User interfaces;
15.Electronic Packaging Solutions for Artificial Intelligence Applications (Invited talk)

机译：人工智能应用的电子封装解决方案（特邀演讲）
- 作者：Dyi-Chung Hu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Substrates;
- Silicon;
- Artificial intelligence;
- Packaging;
- Through-silicon vias;
- Patents;
- Electronics packaging;
16.Reduction the Micro-sized Scratches using Optimal Design of POU Dual Filtration at STI CMP

机译：通过STI CMP的POU双重过滤的优化设计减少微小的划痕
- 作者：Yoon Myung Sub;Bernard Yap Tzen Hian;Tan Kim Wui;Lim Wee Chye;Ariffin Bin Minhar;Looi Hui Jin;Tan Kiang Yong;Foo Thai Min
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Filtration;
- Slurries;
- Silicon compounds;
- Mass production;
- Tools;
- Surface treatment;
- Chemicals;
17.Classification of Solder Joints via Automatic Mistake Reduction System for Improvement of AOI Inspection

机译：通过自动减少错误系统对焊点进行分类以改善AOI检查
- 作者：Yi-Ming Chang;Chia-Chen Wei;Jeffrey Chen;Pack Hsieh
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Inspection;
- Soldering;
- Surface treatment;
- Monitoring;
- Data mining;
- Training;
- Machine learning;
18.Direct Selective Wet Metallization on Glass by Controlling the Hydrophilicity of Glass Surface: Effect of Contact Angle on the Performance of Electroless Deposition

机译：通过控制玻璃表面的亲水性在玻璃上进行直接选择性湿法金属化：接触角对化学沉积性能的影响
- 作者：Kuan-Ting Wang;Tzu-Chien Wei
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Surface treatment;
- Glass;
- Substrates;
- Metallization;
- Rough surfaces;
- Surface roughness;
- Nanoparticles;
19.Development of high performance synchronous rectifier module by multi-chip Cu sintering technology (IMPACT 2018)

机译：通过多芯片Cu烧结技术开发高性能同步整流器模块（IMPACT 2018）
- 作者：J.Y. Chang;S.Y. Fun;K.H. Cheng;H.W. Cheng;H.H. Lin;W.K. Han;S.F. Hsu;C.M. Tseng;T.C. Chang;K. Anai;S. Yamauchi;J. L. Jo;T. Sakaue
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Substrates;
- Rectifiers;
- MOSFET;
- Ceramics;
- Silicon;
- Thermal resistance;
- Thermal conductivity;
20.Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package

机译：球栅阵列封装的铜迹线热机械可靠性分析
- 作者：Sean Shih;Michael YC Lee;Tse-Wei Liao;D.S. Liu;Meng-Kai Shih;David Tarng;CP Hung
- 会议名称：《》 | 2018年
- Copper;
- Reliability;
- Strain;
- Substrates;
- Temperature;
- Young's modulus;
- Stress;
21.The Best EMC Mold Flow Behavior Simulation by Spiral Flow Benchmarking

机译：通过螺旋流标杆法模拟最佳的EMC模具流动行为
- 作者：Xi Hong Chen;Chin Tien Yen;Yu Ting Yang;Wei Ling Ma;Yi-Hsiu Tseng;Chih Chung Hsu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Spirals;
- Numerical models;
- Resins;
- Viscosity;
- Electromagnetic compatibility;
- Temperature measurement;
- Data models;
22.Direct Cable Access to Chip Package through Dense Wires Embedded in the Substrate

机译：通过嵌入基板中的密集线直接电缆访问芯片封装
- 作者：Boping Wu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Substrates;
- Wires;
- Connectors;
- Reflection;
- Crosstalk;
- Cable shielding;
- Impedance;
23.High-aspect-ratio Sub-2-μm Vias Using Thermal Imprint with Build-up Resin

机译：使用热压印和积层树脂的高纵横比亚2μm通孔
- 作者：Takumi Kamibayashi;Hiroyuki Kuwae;Takahiro Kishioka;Yuki Usui;Takuya Ohashi;Mamoru Tamura;Shuichi Shoji;Jun Mizuno
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Resins;
- Etching;
- Silicon;
- Lithography;
- Plasmas;
- Electronic components;
- Fabrication;
24.The Development of High Thermal Dissipation Intelligent Power Module Packaging Technology

机译：高散热智能功率模块封装技术的发展
- 作者：T.J. Yu;K.S. Kao;J.Y. Chang;H.H. Lin;P.K. Chiu;F.J. Leu;T.C. Chang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Multichip modules;
- Copper;
- Integrated circuits;
- Lead;
- Electronic packaging thermal management;
- Insulated gate bipolar transistors;
- Motor drives;
25.Studies of Silver Catalyst System in Print-Circuit Board Application

机译：银催化剂体系在印制电路板中的应用研究
- 作者：Hung Tat CHAN;Yuk Nam HUNG;Kin Cheung LO;Kit Ho TONG;Ping Ling LI;Chit Yiu CHAN
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Resistance;
- Copper;
- Aging;
- Electric shock;
- Silver;
- Reliability;
- Oils;
26.Effects of Substrate Structure on the Warpage of Flip Chip IC Packages

机译：基板结构对倒装芯片IC封装翘曲的影响
- 作者：Yong-Sen Lee;Pei-Yi Lin;Kuo-Tsai Wu;Huei-Huang Lee;Sheng-Jye Hwang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
27.Fluxless Flip Chip Bonding Tech Application for Ultra-High Density Micro-bump Structure

机译：超高密度微凸点结构的无助焊倒装芯片键合技术应用
- 作者：Jiao-Dong Ji;Yung-Ta Li;Shin-Hao Liao;Chiu-Chen Liao;Yu-Min Lo;Hsiang-Hua Huang;Kuo-Haw Yu;Chang-Fu Lin;Key Chung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Bonding;
- Substrates;
- Surface treatment;
- Delamination;
- Inspection;
- Magnetic heads;
- Flip-chip devices;
28.Tiny Passive Chip 008004 and 5μm HD SMT Process Development (IMPACT 2018)

机译：微型无源芯片008004和5μmHD SMT工艺开发（IMPACT 2018）
- 作者：Chih-Yen Chen;Chih-Wei Zhang;Chun-Chi Chiu;Hsun-Fa Li
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Layout;
- Printing;
- Reliability engineering;
- Universal Serial Bus;
- Mass production;
- Proposals;
29.The Proximity Capacitive Gesture Recognition for Recursive Chebyshev Neural Network

机译：递归切比雪夫神经网络的接近电容手势识别
- 作者：Chao-Ting Chu;Wei-Lung Mao;Chung-Wen Hung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Biomedical monitoring;
- Capacitive sensors;
- Monitoring;
- Robot sensing systems;
- Gesture recognition;
- Chebyshev approximation;
- Real-time systems;
30.Study of wafer cleaning process safety using Inherently Safer Design Strategies

机译：使用固有安全设计策略研究晶圆清洗过程的安全性
- 作者：Kuo-Chi Chang;Kai-Chun Chu;Der-Juinn Horng;Jerry Chao-Lee Lin;Vivien Yi-Chun Chen
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Chemicals;
- Etching;
- Electric variables;
- Water;
- Methanol;
- Fires;
- Explosions;
31.A smart lighting system for greenhouses based on Narrowband-IoT communication

机译：基于窄带物联网通信的温室智能照明系统
- 作者：Yung Sheng Chang;Yi Hsiung Chen;Sheng Kai Zhou
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Lighting;
- Internet of Things;
- Power demand;
- Greenhouses;
- Temperature sensors;
- Humidity;
- Monitoring;
32.Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems

机译：异构集成和先进封装系统中低温Cu-Cu直接键合结构设计的仿真分析
- 作者：Yu-Ming Pan;Yu-Tao Yang;Tzu-Chieh Chou;Ting-Yang Yu;Kai-Ming Yang;Cheng-Ta Ko;Yu-Hua Chen;Tzyy-Jang Tseng;Kuan-Neng Chen
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Silicon;
- Substrates;
- Stress;
- Bonding;
- Polymers;
- Three-dimensional displays;
- Packaging;
33.Transition Behavior in Large Deflection of Simply Supported Plate with Piezoelectric Patches under Pretension

机译：预应力下压电贴片简支板大挠度下的过渡行为
- 作者：Chun-Fu CHEN;Shiang-Jui Yu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Sensors;
- Force;
- Standards;
- Boundary conditions;
- Piezoelectric effect;
- Actuators;
- Residual stresses;
34.Fuzzy Proximity Capacitive Gesture Recognition System Analysis and Implement

机译：模糊近距离电容手势识别系统分析与实现
- 作者：Chao-Ting Chu;Chao-Hsi Chang;Chung-Han Yi
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Robot sensing systems;
- Biomedical monitoring;
- Capacitive sensors;
- Monitoring;
- Gesture recognition;
- Medical services;
- Cloud computing;
35.Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper

机译：使用（111）取向的纳米孪晶铜在无真空的环境中进行芯片到芯片的铜直接键合
- 作者：Jing Ye Juang;Kai Cheng Shie;Yu Jin Li;Benson Lin;Chia Cheng Chang;K N Tu;Chih Chen
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Bonding;
- Copper;
- Resistance;
- Soldering;
- Scanning electron microscopy;
- Electrical resistance measurement;
36.Detecting Defects in PCB using Deep Learning via Convolution Neural Networks

机译：通过卷积神经网络使用深度学习检测PCB中的缺陷
- 作者：Venkat Anil Adibhatla;Jiann-Shing Shieh;Maysam F. Abbod;Huan-Chuang Chih;Chi- Chang Hsu;Joseph Cheng
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Convolution;
- Deep learning;
- Training;
- Inspection;
- Biological neural networks;
- Printed circuits;
- Consumer electronics;
37.Study on the Inherently Safer Design Strategy of Semiconductor Process and the Improvement of Facility Safety Management Efficiency

机译：半导体工艺固有的安全设计策略与设施安全管理效率的提高研究
- 作者：Vivien Yi-Chun Chen;Kai-Chun Chu;Kuo-Chi Chang;Der-Juinn Horng;Jerry Chao-Lee Lin
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Corrosion;
- Fires;
- Training;
- Chemicals;
- Dry etching;
38.LTPS-TFTs integrated in RDL for High-End FOPLP Application

机译：集成在RDL中的LTPS-TFT用于高端FOPLP应用
- 作者：Hsin-Cheng Lai;Yu-Hua Chung;Chieh-Wei Feng;Cheng-Hung Yu;Wei-Han Chen;Dzu-How Yu;Tzu-Yen Chang;Chien-Hsun Chu;Terry Tai-Jui Wang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Electrostatic discharges;
- Thin film transistors;
- Plating;
- Chemicals;
- Packaging;
- Ions;
- Copper;
39.Stress Analysis for SiC Power Devices Packaging by Raman Spectroscopy

机译：SiC功率器件封装的拉曼光谱应力分析
- 作者：Tomoyuki Uchida;Ryuichi Sugie
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Silicon carbide;
- Thermal stresses;
- MOSFET;
- Compressive stress;
- Residual stresses;
- Heating systems;
40.IMPACT 2018 Welcome Message

机译：IMPACT 2018欢迎辞
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
41.IMPACT 2018 Committees

机译：IMPACT 2018委员会
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
42.Experimental Characterization of End-Launched Connectors Used in Printed Circuit Boards with Multiline Thru-Reflect-Line Calibration Technique

机译：采用多线直通反射线校准技术的印刷电路板端发射连接器的实验表征
- 作者：Chien-Chang Huang;Chang-Lin Peng;Yu-Ching Chen;Chen-Yu Liao
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Connectors;
- Impedance;
- Calibration;
- Scattering parameters;
- Transmission line measurements;
- Propagation constant;
- Frequency measurement;
43.A Theoretical Study of the Effect of Strain on the Electronic Structure of Dumbbell-shape Graphene Nanoribbons

机译：应变对哑铃形石墨烯纳米带电子结构影响的理论研究
- 作者：Qinqiang Zhang;Takuya Kudo;Ken Suzuki;Hideo Miura
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Photonic band gap;
- Orbits;
- Capacitive sensors;
- Strain;
- Graphene;
44.Recursive Sine Cosine Base Function Neural Network for Proximity Capacitive Gesture Recognition

机译：递归正弦余弦基函数神经网络用于近距离电容手势识别
- 作者：Chao-Ting Chu;Shao-Pin Yang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Biomedical monitoring;
- Neural networks;
- Gesture recognition;
- Capacitive sensors;
- Electromyography;
- Robot sensing systems;
- Monitoring;
45.Characterization of Printed Circuit Board Materials Using Multiple Transmission Lines With Probing Techniques Up to 110 GHz

机译：使用多条传输线以高达110 GHz的探测技术表征印刷电路板材料
- 作者：Chien-Chang Huang;Yu-Ching Chen;Ting-Shao Yeh;Chen-Yu Liao;Wen-Chieh Huang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Stripline;
- Transmission line measurements;
- Probes;
- Dielectric measurement;
- Frequency measurement;
- Substrates;
- Resonant frequency;
46.IS A CYANIDE FREE GOLD BATH ABLE TO PERFORM ADEQUATELY IN A PRODUCTION ENVIRONMENT?

机译：是否可以在生产环境中充分执行无氰无氰金浴？
- 作者：Sandra Nelle;Robert Spreemann;Boris Janssen;Rick Nichols;Gustavo Ramos
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Nickel;
- Gold;
- Flexible printed circuits;
- Copper;
- Soldering;
- Plating;
- Reliability;
47.Simple Mesh Network Protocol for Low Power Wide Area Network

机译：低功耗广域网的简单网状网络协议
- 作者：Chao-Ting Chu;Chao-Hsi Chang;Chung-Han Yi
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Protocols;
- Bluetooth;
- Power demand;
- Mesh networks;
- Wide area networks;
- Wireless mesh networks;
- Zigbee;
48.CHALLENGES OF BALL-ATTACH PROCESS USING FLUX FOR FAN-OUT WAFER/PANEL LEVEL (FOWLP/PLP) PACKAGING

机译：使用通量对扇形晶圆/面板水平（FLOWLP / PLP）包装进行球附着过程的挑战
- 作者：Sze-Pei Lim;Yan Liu;John H Lau;Li Ming
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Passivation;
- Substrates;
- Printing;
- Delamination;
- Packaging;
- Cleaning;
- Rheology;
49.Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook

机译：电解镀铜填充微孔和通孔的现状和未来展望
- 作者：Mustafa Özkök;Sven Lamprecht;Akif Özkök;Simon Chien;Henning Hübner;Christian Ohde
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Copper;
- Filling;
- Thermal conductivity;
- Plating;
- Conductivity;
- Consumer electronics;
- Standards;
50.High Reliability Wire-Less Power Module Structure

机译：高可靠性的无线功率模块结构
- 作者：Wei-Hao Chi;Hao-Chih Chen;Hsueh-Kuo Liao
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Wires;
- Multichip modules;
- Insulated gate bipolar transistors;
- Temperature measurement;
- Inductance;
- Reliability;
- Junctions;
51.Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin

机译：热固性树脂固化收缩反应的热应力模拟方法
- 作者：Hideaki Nagaoka;Masaharu Furuyama;Tomoyuki Akahoshi;Daisuke Mizutani;Seiki Sakuyama;Mami Nagatake;Nobutaka Itoh
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Substrates;
- Temperature measurement;
- Resins;
- Material properties;
- Temperature;
- Manufacturing processes;
- Heating systems;
52.Evaluating Frequency and Temperature Dependences of Printed Circuit Board Permittivity Using Split-Cylinder Resonators

机译：使用分体圆柱谐振器评估印刷电路板介电常数的频率和温度依赖性
- 作者：Kuen-Fwu Fuh
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Temperature measurement;
- Resonant frequency;
- Permittivity;
- Frequency measurement;
- Permittivity measurement;
- Temperature distribution;
- Resonators;
53.Advanced Channel Analysis Method using Channel Quality Comparison and Design of Experiments

机译：利用渠道质量比较和实验设计的先进渠道分析方法
- 作者：Denis Chen;Thonas Su;Jimmy Hsu;YL Li
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Computer aided software engineering;
- Simulation;
- Risk management;
- Design methodology;
- Silicon;
- Universal Serial Bus;
- Guidelines;
54.Fine line panel level plating technology

机译：细线面板级电镀技术
- 作者：Herbert Ötzlinger;Claudia Landstorfer;Tetsuya Onishi;Christian Dunkel;Raoul Schroeder
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Plating;
- Packaging;
- Substrates;
- Surface treatment;
- Electrolytes;
- Chemistry;
- Wafer scale integration;
55.Fatigue Crack Growth on the Interface of Copper and Epoxy Molding Compound under Mixed-Mode Loading

机译：混合模式载荷作用下铜与环氧模塑料界面疲劳裂纹扩展
- 作者：Yu-Jen Chen;Yu-An Deng;Tz-Cheng Chiu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Fatigue;
- Loading;
- Strain;
- Delamination;
- Electromagnetic compatibility;
- Steady-state;
- Substrates;
56.Corrosion Resistance of Surface Finishes for High Reliability Devices

机译：高可靠性设备的表面处理的耐腐蚀性
- 作者：Tsan-Hsien Tseng;Albert T. Wu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Corrosion;
- Surface morphology;
- Surface finishing;
- Copper;
- Coatings;
- Sulfur;
57.IMPACT 2018 General Information

机译：IMPACT 2018一般信息
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
58.A Novel Die Attach Material Having High Die Shear Strength and High Heat Resistance for Brighter LED Device

机译：具有高模切强度和高耐热性的新型模片附着材料，可用于更亮的LED器件
- 作者：Tadatomo Yamada;Manabu Miyawaki;Susumu Miura;Akiko Umeda;Hironori Shizuhata
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Microassembly;
- Light emitting diodes;
- Resistance;
- Resistance heating;
- Strain;
- Reliability;
59.Signal Integrity Analysis of BMC Assisted Remote Debug Solution

机译：BMC辅助远程调试解决方案的信号完整性分析
- 作者：Denis Chen;Thonas Su;Jimmy Hsu;YL Li;Ban Hsu
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Topology;
- Switches;
- Servers;
- Signal integrity;
- Universal Serial Bus;
- Integrated circuit modeling;
60.The Solder Life Prediction Model of Power Module under Thermal Cycling Test (TCT)

机译：热循环测试（TCT）下功率模块的焊接寿命预测模型
- 作者：Hao-Chih Chen;Siao-Wei Guo;Hsueh-Kuo Liao
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Strain;
- Mathematical model;
- Creep;
- Load modeling;
- Loading;
- Predictive models;
- Reliability;
61.Investigation of Non-Pressure Sinter Silver in Power Module with High Accelerated Stress Aging Test

机译：高加速老化试验研究功率模块中的无压烧结银
- 作者：Yu-Wen Huang;Min-Cheng Tsai;Po-Yin Hsu;Hao-Chiang Hsu;Hsueh-Kuo Liao
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Silver;
- Surges;
- Aging;
- Temperature measurement;
- Thermal stability;
- Temperature;
62.IMPACT 2018 Sponsors

机译：IMPACT 2018赞助商
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
63.A VCO with Dynamic Body Injection and Class-C Technique

机译：具有动态人体注射和C级技术的VCO
- 作者：Wen-Cheng Lai;Sheng-Lyang Jang;Bi-Shen Shih
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Voltage-controlled oscillators;
- Phase noise;
- Frequency measurement;
- Noise measurement;
- Power demand;
- Phase measurement;
64.An Wide Locking Range Injection-Locked Frequency Divider by Dual Resonance Tank

机译：双谐振箱的宽锁定范围注入锁定分频器
- 作者：Wen-Cheng Lai;Sheng-Lyang Jang;Shih-Jie Jian
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Resonant frequency;
- Mixers;
- Varactors;
- Tuning;
- Phase noise;
- Optical frequency conversion;
65.Novel Thermal Model Development for System Level Thermal Performance

机译：用于系统级热性能的新型热模型开发
- 作者：Hsin-En Chen;Meng-Kai Shih;David Tarng;CP Hung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Atmospheric modeling;
- Integrated circuit modeling;
- Analytical models;
- Computational modeling;
- Temperature;
- Heat sinks;
66.Evaluation of the Anti-Sulfur Corrosion Capacity for Chip Resistor and Conformal Coating by Way of Flower-of-Sulfur (FoS) Methodology

机译：硫花（FoS）方法评估贴片电阻和保形涂层的抗硫腐蚀能力
- 作者：Dem Lee;Leo Yao;Jeffrey Lee;Burgess Chan;Jennifer Ku;Susan Huang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Coatings;
- Resistors;
- Corrosion;
- Sulfur;
- Silver;
- Consumer electronics;
67.Thinner Package Process for High Band Width Flip Chip CSP

机译：高带宽倒装芯片CSP的更薄封装工艺
- 作者：Han Hung Chen;Yu Kai Chen;Wen Hung Hsiao;Yu Sheng Wang;Rong Zheng Lin;Yuan-Hung Hsu;Chang Fu Lin
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Substrates;
- Etching;
- Force;
- Delamination;
- Lasers;
- Compounds;
68.Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer

机译：具有通过硅的中介层的更薄堆叠芯片封装的板级可靠性
- 作者：Wen Shan Tsai;Bruce Hsu;Fred Chang;Yun Long Huang;Joe Lin;C. F. Lin;C. Key Chung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Legged locomotion;
- Substrates;
- Silicon;
- Stress;
- Soldering;
- Reliability;
- Thermal stresses;
69.Semi-automation Delta-L for PCB Loss Electrical Characterization

机译：半自动化Delta-L，用于PCB损耗电特性分析
- 作者：Jimmy Hsu;Cucumber Lin;Morgan Ku;Thonas Su;Denis Chen
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Probes;
- Loss measurement;
- Time measurement;
- Frequency measurement;
- Testing;
- Volume measurement;
- Atmospheric measurements;
70.Thermal Simulation and Measurement for EV charger Full SiC Power Module

机译：EV充电器全SiC功率模块的热仿真和测量
- 作者：P.K Chiu;H. Lee;S.T Wu;C.M Tzeng;H.H Lin;Y.S Chen;F.J. Leu;T.T Lin;Y.Y Lin;C.K Liu;T.C. Chang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Silicon carbide;
- Multichip modules;
- Thermal resistance;
- Temperature measurement;
- Electrical resistance measurement;
- Power demand;
71.Design Optimization of High Density Fine Line Substrate Package Using Bandwidth Analysis

机译：基于带宽分析的高密度细线基板封装设计优化
- 作者：Hung-Chun Kuo;Chih-Wen Kuo;Fu-Chen Chu;Chen-Chao Wang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Bandwidth;
- Wires;
- Substrates;
- Power transmission lines;
- Copper;
- Propagation losses;
- Couplings;
72.On-Package Decoupling Capacitor Performance Improvement of Flip-Chip Packages for High Power Application

机译：大功率应用倒装芯片封装的封装上去耦电容器性能的改进
- 作者：Hung-Chun Kuo;Chih-Wen Kuo;Cheng-Yu Tsai;Fu-Chen Chu;Chen-Chao Wang
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Inductance;
- Substrates;
- Capacitors;
- Power system dynamics;
- Flip-chip devices;
- Mathematical model;
- Universal Serial Bus;
73.Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process

机译：固化成型过程中与固化有关的化学收缩和粘弹性松弛的翘曲建模与表征
- 作者：Shu-Shen Yeh;Po-Yao Lin;Kuang-Chun Lee;Jin-Hua Wang;Wen-Yi Lin;Ming-Chih Yew;Po-Chen Lai;Chia-Kuei Hsu;Che-Chia Yang;Li-Ling Liao;Yu-Sheng Lin;Shin-Puu Jeng
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Predictive models;
- Chemicals;
- Temperature;
- Temperature measurement;
- Finite element analysis;
- Solid modeling;
- Computational modeling;
74.Power Pre-Layout Optimization Tool (PPLOT) for Early Design Phase Power Integrity Layout Assessment

机译：电源预布局优化工具（PPLOT），用于早期设计阶段电源完整性布局评估
- 作者：Jimmy Hsiao;Denis Chen
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Layout;
- Tools;
- Resistance;
- Loading;
- Optimization;
- Hardware;
- Estimation;
75.A Novel Disposable Electrochemical Sensor Packaging with Application for the Detection of Uric Acid

机译：新型一次性电化学传感器包装及其在尿酸检测中的应用
- 作者：Zuo-Xiang Gan;Han-Sheng Chen;Yu-Chang Lin;Kuan-Jung Chung
- 会议名称：《International Microsystems, Packaging, Assembly and Circuits Technology Conference》 | 2018年
- Biosensors;
- Electrodes;
- Packaging;
- Current measurement;
- Hospitals;
- Biochemistry;
- Electric potential;