Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin

摘要

Thermal warp of substrates is largely influenced by the cure shrinkage reaction of resins, as well as the mismatch in the residual copper rate of conductive layers and the coefficient of thermal expansion (CTE) of substrate materials. In this study, the thermal warp in a substrate consisting of only resin was simulated under the manufacturing process condition of the resin substrate. As a result, the warp behavior of the resin substrate was accurately predicted.