DYNAMICALLY CONTROLLING VOLTAGE PROVIDED TO THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) TO ACCOUNT FOR PROCESS VARIATIONS MEASURED ACROSS INTERCONNECTED IC TIERS OF 3DICs

摘要

Dynamically controlling voltage provided to three-dimensional (3D) integrated circuits (ICs) (3DICs) to account for process variations measured across interconnected IC tiers of 3DICs are disclosed herein. In one aspect, a 3DIC process variation measurement circuit (PVMC) is provided to measure process variation. The 3DIC PVMC includes stacked logic PVMCs configured to measure process variations of devices across multiple IC tiers and process variations of vias that interconnect multiple IC tiers. The 3DIC PVMC may include IC tier logic PVMCs configured to measure process variations of devices on corresponding IC tiers. These measured process variations can be used to dynamically control supply voltage provided to the 3DIC such that operation of the 3DIC approaches a desired process corner. Adjusting supply voltage using the 3DIC PVMC takes into account interconnected properties of the 3DIC such that the supply voltage is adjusted to cause the 3DIC to operate in the desired process corner.