Will monolithic 3D IC technology become a real competitor to 3DIC with TSV?

摘要

The language of 3DIC is certainly a bit confusing, especially when it comes to TSV-based 3DIC and what can be called monolithic 3DIC. Back end (BE) 3DIC with TSV is a parallel process where each layer or stratum is fabricated with TSV separately and subsequently joined. Monolithic 3DIC is a front end (FE), sequential process where a second layer of silicon is deposited or grown onto the first finished chip and the transistor and interconnect processes are repeated.