In this laminated sintered ceramic wiring substrate, at least some of an in-plane conductor is fine-lined. Nevertheless, the cross-sectional shape of the fine-lined in-plane conductor is made into a trapezoid; and the height of the cross-section of the trapezoidal shape (a), the length of the lower base (c) and the length of the upper base (d), and the spacing (b) between the lower bases of cross-sections of trapezoidal shapes of in-plane conductors that are adjacent within a plane parallel to the main surface of the substrate are configured so as to satisfy a specific relation. It is thereby possible to minimize problems such as a wiring often becoming open (broken) or becoming less reliable in a high-temperature/high-humidity environment. The present invention provides a laminated sintered ceramic wiring substrate that has a low incidence of defects relating to open or shorted circuits, while also having excellent high-humidity/high-moisture reliability, despite having a fine wiring layer. A faster, more compact, lower-profile (thinner), high-reliability semiconductor package is provided by using this wiring substrate.
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