首页> 外国专利> THIN-FILM MANUFACTURING METHOD, THIN-FILM MANUFACTURING APPARATUS, MANUFACTURING METHOD FOR A PHOTOELECTRIC CONVERSION ELEMENT, MANUFACTURING METHOD FOR A LOGIC CIRCUIT, MANUFACTURING METHOD FOR A LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD FOR A LIGHT CONTROL ELEMENT

THIN-FILM MANUFACTURING METHOD, THIN-FILM MANUFACTURING APPARATUS, MANUFACTURING METHOD FOR A PHOTOELECTRIC CONVERSION ELEMENT, MANUFACTURING METHOD FOR A LOGIC CIRCUIT, MANUFACTURING METHOD FOR A LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD FOR A LIGHT CONTROL ELEMENT

机译:薄膜制造方法,薄膜制造装置,用于光电转换元件的制造方法,用于逻辑电路的制造方法,用于发光元件的制造方法以及用于光控元件的制造方法

摘要

[Object] To provide a thin-film manufacturing method, a thin-film manufacturing apparatus, a manufacturing method for a photoelectric conversion element, a manufacturing method for a logic circuit, a manufacturing method for a light-emitting element, and a manufacturing method for a light control element with which number-of-layers control and laminating and film-forming of different kinds of materials can be performed.;[Solving Means] A thin-film manufacturing method according to the present technology includes: bringing an electrically conductive film-forming target into contact with a first terminal and a second terminal; heating a first region that is a region of the film-forming target between the first terminal and the second terminal by applying voltage between the first terminal and the second terminal; supplying a film-forming raw material to the first region; and forming a thin film in the first region by controlling reaction time such that a thin film having a desired number of layers is formed.
机译:[目的]提供一种薄膜制造方法,薄膜制造装置,光电转换元件的制造方法,逻辑电路的制造方法,发光元件的制造方法以及制造方法。本发明的薄膜的制造方法包括:使导电性与光控制元件的层数控制和层压以及不同种类的材料的成膜有关。[解决方案]成膜靶与第一端子和第二端子接触;通过在第一端子和第二端子之间施加电压来加热作为第一端子和第二端子之间的成膜目标区域的第一区域。向第一区域供应成膜原料;通过控制反应时间在第一区域中形成薄膜,从而形成具有所需层数的薄膜。

著录项

  • 公开/公告号US2019252182A1

    专利类型

  • 公开/公告日2019-08-15

    原文格式PDF

  • 申请/专利权人 SONY CORPORATION;

    申请/专利号US201716303689

  • 发明设计人 KOJI KADONO;SHINJI IMAIZUMI;

    申请日2017-05-17

  • 分类号H01L21/02;C01B21/064;C01G39/06;C23C16/46;C23C16/52;C23C16/54;H01L31/18;H01L33;H01L33/42;

  • 国家 US

  • 入库时间 2022-08-21 12:10:18

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