A purpose of the present invention is to provide a thermosetting resin composition which is excellent in terms of heat resistance, reliability concerning moisture resistance, and moisture-absorption reflow characteristics.The thermosetting resin composition is characterized by comprising (A) a thermosetting resin having an unsaturated double bond at an end, (B) a silica filler surface-treated with a specific long-chain spacer type silane coupling agent including an alkyl group having an unsaturated double bond at at least an end, and (C) a flexibility-imparting resin (excluding component (A)). It is preferable that the unsaturated double bond of component (B) be a vinyl group.
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