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Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board

机译:挠性印刷线路板,具有挠性印刷线路板的电子设备以及具有挠性印刷线路板的电子设备的制造方法

摘要

A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal body having a columnar shape and fitted in a hole penetrating through the flexible insulating layer and the conductor layer such that the metal body is formed of a welding base material and has an end portion formed to be joined to an electrode of a battery by welding. The welding base material of the metal body of the flexible printed wiring board includes the same material as the electrode of the battery.
机译:挠性印刷线路板包括挠性绝缘层,形成在挠性绝缘层的表面上的导体层和具有圆柱状并且装配在穿过挠性绝缘层和导体层的孔中的金属体,从而金属体由焊接基材形成,并且其端部形成为通过焊接与电池的电极接合。柔性印刷线路板的金属体的焊接基材包括与电池的电极相同的材料。

著录项

  • 公开/公告号US10784642B2

    专利类型

  • 公开/公告日2020-09-22

    原文格式PDF

  • 申请/专利权人 IBIDEN CO. LTD.;

    申请/专利号US201816049904

  • 发明设计人 TAKAHISA HIRASAWA;TAKAYUKI FURUNO;

    申请日2018-07-31

  • 分类号H01R43/20;H05K1/02;H05K1/09;H05K1/18;H05K3;B23K26/21;H01R43/02;H01R12/65;B23K103/04;B23K101/36;H05K3/32;H05K3/40;

  • 国家 US

  • 入库时间 2022-08-21 11:30:11

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