Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV

摘要

Investigation of the influence of the mechanical accuracy of a hot press on discrepancies at the through-hole-pad of Multilayer Printed Wiring Boards (MPWBs) clarified that higher mechanical accuracy of the hot press realizes fewer discrepancies. As a result, precise adhesion of MPWBs is facilitated by developing a precise hot press which has two new functions. One is a mechanism for maintaining parallelism below 0. O5mm with a highly rigid frame. The other is a mechanism for controlling the profile of a heating plate surface with 3 annular oil cylinders to produce board thickness deviation of less than 0. 035mm.