The present disclosure provides the steps of forming a stress control layer made of a group III nitride on a silicon film formation substrate by chemical vapor deposition (CVD); And, forming an Al x Ga 1-x N (0.5≤x≤1) piezoelectric thin film on the stress control layer by a physical vapor deposition method at a temperature of 0.3Tm (Tm; melting point of the piezoelectric thin film material) or higher; A method for manufacturing an Al x Ga 1-x N (0.5 ≤ x ≤ 1 ) piezoelectric thin film, and an Al x Ga 1-x N (0.5 ≤ x ≤ 1 ) piezoelectric thin film device including the piezoelectric thin film. It's about how.
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机译:本公开提供了通过化学气相沉积(CVD)在硅膜形成基板上形成由III族氮化物制成的应力控制层的步骤;并且,在其上形成Al x Sub> Ga 1 Sub> - Sub> x Sub> N(0.5≤x≤1)的压电薄膜在0.3Tm(Tm;压电薄膜材料的熔点)以上的温度下,通过物理气相沉积法形成应力控制层。一种Al x Sub> Ga 1-x Sub> N(0.5≤ x Sub>≤ 1 Sub>)压电薄膜的制造方法以及Al x Sub> Ga 1-x Sub> N(0.5≤ x Sub>≤ 1 Sub>)压电薄膜器件,包括压电薄膜。关于如何。
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