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AlxGa1-xN 0.5x1 Method of manufacturing AlxGa1-xN 0.5x1 piezoelectric thin films with high purity and their apparatus using the thin film

机译:AlxGa1-xN 0.5x1高纯度AlxGa1-xN 0.5x1压电薄膜的制造方法及其使用该薄膜的设备

摘要

The present disclosure provides the steps of forming a stress control layer made of a group III nitride on a silicon film formation substrate by chemical vapor deposition (CVD); And, forming an Al x Ga 1-x N (0.5≤x≤1) piezoelectric thin film on the stress control layer by a physical vapor deposition method at a temperature of 0.3Tm (Tm; melting point of the piezoelectric thin film material) or higher; A method for manufacturing an Al x Ga 1-x N (0.5 ≤ x1 ) piezoelectric thin film, and an Al x Ga 1-x N (0.5 ≤ x1 ) piezoelectric thin film device including the piezoelectric thin film. It's about how.
机译:本公开提供了通过化学气相沉积(CVD)在硅膜形成基板上形成由III族氮化物制成的应力控制层的步骤;并且,在其上形成Al x Ga 1 - x N(0.5≤x≤1)的压电薄膜在0.3Tm(Tm;压电薄膜材料的熔点)以上的温度下,通过物理气相沉积法形成应力控制层。一种Al x Ga 1-x N(0.5≤ x 1 )压电薄膜的制造方法以及Al x Ga 1-x N(0.5≤ x 1 )压电薄膜器件,包括压电薄膜。关于如何。

著录项

  • 公开/公告号KR20200122802A

    专利类型

  • 公开/公告日2020-10-28

    原文格式PDF

  • 申请/专利权人 안상정;

    申请/专利号KR20190046009

  • 发明设计人 안상정;

    申请日2019-04-19

  • 分类号H01L41/314;H01L41/08;H01L41/187;

  • 国家 KR

  • 入库时间 2022-08-21 11:05:41

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