首页> 外国专利> Si Si Ni METHOD FOR PRODUCING NICKEL THIN FILM ON Si SUBSTRATE BY CHEMICAL VAPOR DEPOSITION METHOD AND METHOD FOR PRODUCING Ni SILICIDE THIN FILM ON Si SUBSTRATE

Si Si Ni METHOD FOR PRODUCING NICKEL THIN FILM ON Si SUBSTRATE BY CHEMICAL VAPOR DEPOSITION METHOD AND METHOD FOR PRODUCING Ni SILICIDE THIN FILM ON Si SUBSTRATE

机译:Si Si Ni化学气相沉积法在硅基体上制备镍薄膜的方法以及在硅基体上制备硅化镍薄膜的方法

摘要

The present invention is a method for producing a nickel thin film on a Si substrate by a chemical vapor deposition method, and as a raw material compound, a nickel, cyclopentadienyl group (Cp) or a derivative thereof and 3 to 9 carbon atoms represented by the following formula It is a nickel complex coordinated by the chain | strand or cyclic alkenyl group contained, or its derivative (s), The hydrocarbon type nickel complex which does not contain elements other than carbon and hydrogen in a structure is used, Hydrogen is used as reaction gas, Moreover, film-forming conditions It is a method of manufacturing a nickel thin film at 1-150 torr and film forming temperature of 80-250 degreeC. [Formula 1] (Wherein X is a linear or cyclic alkenyl group or derivative thereof containing 3 to 9 carbon atoms. Substituents R 1 to R 5 of a cyclopentadienyl group are C n H 2n+1 and n is 0 to 6 Is an integer of)
机译:本发明是通过化学气相沉积法在Si衬底上制备镍薄膜的方法,并且作为原料化合物,镍,环戊二烯基(Cp)或其衍生物和由3至9个碳原子表示下式是由链配位的镍配合物|使用结构中不含碳和氢以外的元素的链状或环状的链烯基或其衍生物,使用不含有碳和氢以外的元素的烃系镍络合物,作为反应气体使用氢,另外,成膜条件为一种制造镍薄膜的方法,该薄膜的厚度为1-150托,成膜温度为80-250℃。 [式1](其中X是含有3至9个碳原子的直链或环状烯基或其衍生物。环戊二烯基的取代基R 1 至R 5 为C n H 2n +1 并且n为0到6是的整数

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