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On the strengthening effects of interfaces in multilayer fcc metallic composites

机译:多层FCC金属复合材料中界面的强化作用

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The slip behaviour in coherent and semicoherent metallic bilayer composites is examined by atomic simulation in the Cu/Ni and Cu/Ag systems. The coherent interface in Cu/Ni, although energetically unfavourable relative to the semicoherent interface in thick layers, reveals several interesting phenomena. Linear elastic predictions of lattice strains to achieve coherency (removing the 2.7% lattice mismatch) are found not to satisfy equilibrium. The cause is nonlinearity in the elastic response, The application of stresses needed for glide dislocations to cross the interface or to escape from the interface exacerbates the nonlinearities in the elastic response of the system. Koehler forces, arising from elastic mismatch. are in some cases observed to have the wrong sign relative to linear elastic predictions. Core structures of misfit dislocations in semicoherent interfaces are observed to be quite different in the cube-on-cube oriented Cu/Ni and Cu/Ag systems with interfaces parallel to (010). In the former case, the (a/2)(110) misfit dislocations have very narrow cores in the plane of the interface but dissociate into Lomer-Cottrell locks out of the interface towards the Cu side. The dissociation is enhanced by the application of tensile stresses and can lead to reactions that form continuous stacking-fault structures. Such structures are shown to be potent barriers to slip. The stability of such structures are analysed and, within the approximations used, we find that such structures may be more stable than the usual two-dimensional flat grid of misfit dislocations. The misfit dislocations at Cu-Ag interfaces, on the other hand. are wide and so fairly mobile in the interface plane. Reactions between misfit dislocations and glide dislocations are discussed. [References: 10]
机译:在铜/镍和铜/银体系中,通过原子模拟检查了相干和半相干金属双层复合材料的滑移行为。 Cu / Ni中的相干界面尽管相对于厚层中的半相干界面在能量上不利,但它揭示了一些有趣的现象。发现实现应变的晶格应变的线性弹性预测(消除了2.7%的晶格失配)不满足平衡要求。原因是弹性响应中的非线性。滑移位错穿过界面或从界面逸出所需的应力的施加加剧了系统弹性响应中的非线性。弹性不匹配引起的科勒力。在某些情况下,相对于线性弹性预测而言,它们具有错误的符号。观察到半相干界面错配位错的核心结构在界面平行于(010)的立方体对立方体的Cu / Ni和Cu / Ag系统中差异很大。在前一种情况下,(a / 2)(110)错配位错在界面平面中具有非常窄的核心,但解离为Lomer-Cottrell并从界面向Cu侧锁定。通过施加拉应力可增强解离作用,并可导致形成连续堆垛层错结构的反应。这种结构显示出是滑动的有效屏障。分析了这种结构的稳定性,并且在所使用的近似值内,我们发现这种结构可能比错位错位的通常的二维平面网格更稳定。另一方面,Cu-Ag界面处的失配位错。的宽度很大,因此在界面平面上可以移动。讨论了失配位错和滑行位错之间的反应。 [参考:10]

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