THEORETICAL AND EXPERIMENTAL STUDIES OF SINGLE-CHIP-PROCESSED MINIATURE SILICON CONDENSER MICROPHONE WITH CORRUGATED DIAPHRAGM

摘要

A miniature single-chip-processed silicon condenser microphone with a corrugated diaphragm has been developed. The microphone with a highly sensitive diaphragm 1 mm(2) in area and a highly rigid backplate is fabricated in a single-chip process. The finite-element method (FEM) and equivalent-circuit method have been used to evaluate the mechanical and acoustic performance. Diaphragms with different corrugation configurations are simulated and tested, and an optimized structure of high mechanical sensitivity has been achieved. Microphone sensitivities in the range 9.6-14.2 mV Pa-1 have been recorded under bias voltages of 10-20 V, with good reproducibility. The frequency bandwidth of the devices is between 9 and 16 kHz. The simulated results are in good agreement with the experiments. (C) 1997 Elsevier Science S.A. [References: 23]