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首页> 外文期刊>Modern Physics Letters, B. Condensed Matter Physics, Statistical Physics, Applied Physics >Influence of hydrogen, ion distribution and silyl radical surface diffusion length on silicon thin film growth under high pressure and high power in VHF-PECVD
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Influence of hydrogen, ion distribution and silyl radical surface diffusion length on silicon thin film growth under high pressure and high power in VHF-PECVD

机译:VHF-PECVD中氢,离子分布和甲硅烷基表面扩散长度对高压大功率硅薄膜生长的影响

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摘要

Microcrystalline silicon thin films were prepared by VHF-PECVD and studied by several diagnostic techniques. Deposition rate and Raman crystallinity were mapped out on the pressure-power density plane. A model was constructed based on the one-electron impact model to obtain the densities of different silicon related radicals, and densities of hydrogen in the plasma and a quantitative kinetic surface reaction model was constructed to obtain silyl diffusion length on the surface. Microcrystalline silicon growth was understood by a competing dominance between hydrogen etching, SiH2 generation, ion distribution and SiH3 diffusion length on the surface. These results contribute to understand microcrystalline silicon growth process, which is very important in fabricating microcrystalline silicon materials and solar cells.
机译:通过VHF-PECVD制备微晶硅薄膜,并通过几种诊断技术进行研究。在压力-功率密度平面上绘制出沉积速率和拉曼结晶度。基于单电子碰撞模型构建了一个模型,以获得不同的硅相关自由基的密度,以及等离子体中氢的密度,并构建了定量动力学表面反应模型,以获取在表面的甲硅烷基扩散长度。通过氢蚀刻,SiH2生成,离子分布和表面上SiH3扩散长度之间的竞争优势可以理解微晶硅的生长。这些结果有助于理解微晶硅的生长过程,这对于制造微晶硅材料和太阳能电池非常重要。

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