Improvement of Adhesion between Copper Layer and Polyimide Films Modified with Alkaline Potassium Permanganate and/or Alkali Surface Treatments

摘要

The adhesion strength of polyimide films were enhanced by treatment with alkali and/or alkaline potassium permanganate. No effect observered on the thermal decomposition as measured by TGA. The chemically modified PI film surface was then treated with a catalyst, coated with nickel by electroless plating, and a subsequent layer of electrolytically applied copper. Water contact angles on the treated PI surface were decreased. As surface roughness of treated PI films was increased, adhesion increased also. Even though the modified PI films had little decrease in their thermal properties, they demonstrated a maximum adhesion strength up to 837 gf/cm.