BGA optical joint inspection criteria

摘要

Visual examination of ball grid array (BGA) solder joints is best achieved using an enderscope system, available from a number of suppliers world wide. These systems have been specifically designed to allow solder joints to be examined between the base of the device and the printed board. Often there are limited stand-off heights and overhang restrictions due to the body of the package. The close proximity of components to the body of the device to be examined may also limit the opportunity for inspection, particularly when scanning along the sides of devices. With care, design engineers can always leave areas free of parts, particularly on the corners of adjacent sides of a device.