A new method of noncontact measurement for 3D micro pattern in semiconductor wafer: implementing a new optical probe

摘要

In this paper, a new type of noncontactondestructive measuring method has been developed, comprising a new optical probe, precision stages, and controllers. The new optical probe has been designed using the reflected slit beam through the optical window. The optical measurement system has been implemented around light illumination, optical lenses, optical window, and beam splitter. Efficient analysis algorithm has been developed in order to analyse the 3D micro pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, giving nanometer vertical resolution.