WAFER FUSION FOR SURFACE-NORMAL OPTOELECTRONIC DEVICE APPLICATIONS

Dubravko I. Babic; John E. Bowers; Evelyn L. Hu; Long Yang; Kent Carey

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WAFER FUSION FOR SURFACE-NORMAL OPTOELECTRONIC DEVICE APPLICATIONS

机译：适用于表面正常光电设备的晶圆融合

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This paper discusses the issues connected with the application of fusion bonding technology for surface-normal optoelectronic devices (III-V semiconductors). The InP/GaAs fusion bonding technology employed in the development of long-wavelength vertical-cavity lasers is described.

机译：本文讨论与熔融键合技术在表面法向光电子器件（III-V半导体）中的应用有关的问题。描述了在开发长波长垂直腔激光器中采用的InP / GaAs熔合技术。

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《International Journal of High Speed Electronics and Systems: Devices, Integrated Circuits and Systems, Optical and Quantum Electronics》 |1997年第2期|共20页
作者
Dubravko I. Babic; John E. Bowers; Evelyn L. Hu; Long Yang; Kent Carey;
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正文语种 eng
中图分类无线电电子学、电信技术;
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1. WAFER FUSION FOR SURFACE-NORMAL OPTOELECTRONIC DEVICE APPLICATIONS [J] . Dubravko I. Babic, John E. Bowers, Evelyn L. Hu, International Journal of High Speed Electronics and Systems: Devices, Integrated Circuits and Systems, Optical and Quantum Electronics . 1997,第2期

机译：适用于表面正常光电设备的晶圆融合
2. Does Optoelectronic Watermark Technology Migrate Into Business and Industry in the Near Future?Applications of Optoelectronic Watermarking Technology to New Business and Industry Systems Utilizing Flat-Panel Displays and Smart Devices [J] . Uehira Kazutake, Suzuki Kayo, Ikeda Hiroaki Industry Applications, IEEE Transactions on . 2016,第1期

机译：光电水印技术是否会在不久的将来进入工商业？采用平板显示器和智能设备的光电水印技术在新工商业系统中的应用
3. Wafer-Scale Substitutional Doping of Monolayer MoS2 Films for High-Performance Optoelectronic Devices [J] . Kim Youngchan, Bark Hunyoung, Kang Byunggil, ACS applied materials & interfaces . 2019,第13期

机译：用于高性能光电器件的单层MOS2薄膜的晶圆级替代掺杂
4. Wafer fusion technology for optoelectronic devices [C] . Bowers, J., Hawkins, . 2001

机译：光电器件的晶圆融合技术
5. Wafer bonding with low-temperature grown compound semiconductor materials for optoelectronic device application. [D] . Chang, Kuo-Lih. 2003

机译：晶圆结合低温生长的化合物半导体材料，用于光电器件应用。
6. Wafer-Scale Integration of Graphene-based Electronic Optoelectronic and Electroacoustic Devices [O] . He Tian, Yi Yang, Dan Xie, -1

机译：基于石墨烯的电子光电和电声器件的晶圆级集成
7. Wafer-Scale Integration of Graphene-based Electronic, Optoelectronic and Electroacoustic Devices [O] . He Tian, Yi Yang, Dan Xie, 2014

机译：基于石墨烯的电子，光电子和电声装置的晶圆级集成
8. Wafer Fusion: A Novel Technique for Optoelectronic Device Fabrication andMonolithic Integration [R] . Liau, Z. L., Mull, D. E. 1990

机译：晶圆融合：一种用于光电器件制造和单片集成的新技术

WAFER FUSION FOR SURFACE-NORMAL OPTOELECTRONIC DEVICE APPLICATIONS

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