机译:基于应力诱导界面热接触电阻的双段热整流器热整流增强
Univ Sci &
Technol Beijing Sch Math &
Phys Beijing Key Lab Magneto Photoelect Composite &
In Beijing 100083 Peoples R China;
China Aerodynam Res &
Dev Ctr Computat Aerodynam Inst Mianyang 621000 Sichuan Peoples R China;
Univ Sci &
Technol Beijing Sch Civil &
Resource Engn Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Sch Civil &
Resource Engn Beijing 100083 Peoples R China;
China Acad Launch Vehicle Technol Beijing 100076 Peoples R China;
China Acad Launch Vehicle Technol Beijing 100076 Peoples R China;
Univ Sci &
Technol Beijing Sch Math &
Phys Beijing Key Lab Magneto Photoelect Composite &
In Beijing 100083 Peoples R China;
Thermal rectification; Thermal contact resistance; Bi-segment thermal rectifier; Finite element method;
机译:基于应力诱导界面热接触电阻的双段热整流器热整流增强
机译:互为导热介质和热整流现象下规则纹状体的有效热接触电阻
机译:跨SiGe纳米线轴向结的热传递:界面热阻和热整流
机译:使用电接触电阻测量表征金属微织构热界面材料中的热接触电阻
机译:APTMC:与ANSYS一起使用的接口程序,用于热和热诱导应力建模/模拟第1级和第2级VLSI包装
机译:理想化的双段式热整流器的最大整流比
机译:理想化双段热整流器的最大整流比