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APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING

机译：APTMC：与ANSYS一起使用的接口程序，用于热和热诱导应力建模/模拟第1级和第2级VLSI包装

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作者
SHIANG, JYUE-JON;
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作者单位

The University of Arizona;

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授予单位 The University of Arizona;
学科
学位 M.S.
年度 1987
页码 148 p.
总页数 148
原文格式 PDF
正文语种 eng
中图分类
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1. Finite element modelling of the thermal stress field during processing of VLSI multilevel structures [J] . Igic P.M., Mawby P.A. Electronics Letters . 1998,第5期

机译：VLSI多层结构加工过程中热应力场的有限元建模
2. Wafer level package with thermal-stress-absorbing interface structure and elongated pad [J] . Gu-Sung Kim, Sarah Eunkyung Kim Microelectronic Engineering . 2012,第Jana期

机译：晶圆级封装，具有吸收热应力的界面结构和细长的焊盘
3. Microlevel manufacturing process simulation of carbon fiber/epoxy composites to analyze the effect of chemical and thermal induced residual stresses [J] . Brauner C., Block T.B., Purol H., Journal of Composite Materials . 2012,第17期

机译：碳纤维/环氧树脂复合材料的微型制造过程仿真，以分析化学和热诱导残余应力的影响
4. Thermal modeling and simulation of a package-on-package embedded micro wafer level package (EMWLP) structure at the package and system-level [C] . 2010 12th Electronics Packaging Technology Conference . 2010

机译：封装和系统级的封装级嵌入式微晶圆级封装（EMWLP）结构的热建模和仿真
5. Fast chip-level static and transient thermal analysis method for thermal management of VLSI ICs in packages. [D] . Park, Je-Hyoung. 2009

机译：快速的芯片级静态和瞬态热分析方法，用于封装中VLSI IC的热管理。
6. Control of simian virus 40 gene expression at the levels of RNA synthesis and processing: thermally induced changes in the ratio of the simian virus 40 early mRNAs and proteins. [O] . J C Alwine, G Khoury 1980

机译：在RNA合成和加工水平上控制猿猴病毒40基因表达：热诱导猿猴病毒40早期mRNA和蛋白质比例的变化。
7. APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING [O] . Shiang Jyue-Jon 1956- 1987

机译：APTMC：与ANSYS一起使用的接口程序，用于热和热诱导应力建模/模拟第1级和第2级VLSI包装
8. Study of Thermally Induced Deep Levels in Al-Doped Si. [R] . Marchand, R. L., Sah, C. T. 1976

机译：al掺杂si中热致深层的研究。

APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING

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