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首页> 外文期刊>CERAMICS INTERNATIONAL >Preparation of flower-shaped silica abrasives by double system template method and its effect on polishing performance of sapphire wafers
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Preparation of flower-shaped silica abrasives by double system template method and its effect on polishing performance of sapphire wafers

机译:双系统模板法制备花形二氧化硅磨料及其对蓝宝石晶圆抛光性能的影响

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摘要

As one of the most important factors of chemical mechanical polishing, abrasives have their unique mechanical grinding action and chemical action, providing the most critical support for the nanometer surface smoothness of workpieces. In this paper, the irregularly flower-shaped silica abrasives were prepared by a novel double-system microemulsion template method to replace conventional spherical silica abrasives. The synthesis principle was mainly based on heterogeneous polycondensation growth on irregular silica seeds. The morphology of the flower-shaped silica was verified by scanning electron microscopy. Due to the particularity of the synthesis method, a new environmentally friendly experimental device was designed. Chemical mechanical polishing experiments showed that the material removal rate of the flower-shaped silica with the solid content of only 6% is 217.4% of the spherical silica. The Ambios Xi-100 surface profiler showed that the surface roughness of flower-shaped silica was comparable to that of spherical silica. By establishing a contact wear model, it is analyzed that the actual contact area between the flower-shaped silica abrasives and the sapphire wafer is larger and the chemical solid phase reaction occurs more. This study provides a novel and feasible method for preparing irregularly shaped silica.
机译:作为化学机械抛光的最重要因素之一,磨料具有独特的机械研磨作用和化学作用,为工件的纳米表面光滑度提供最关键的支持。本文通过新型双系统微乳液模板方法制备不规则的花形二氧化硅研磨剂,以取代常规的球形二氧化硅磨料。合成原理主要基于不规则二氧化硅种子的异质缩聚生长。通过扫描电子显微镜验证了花形二氧化硅的形态。由于合成方法的特殊性,设计了一种新的环保实验装置。化学机械抛光实验表明,具有仅6%的固体含量的花形二氧化硅的材料去除率是球形二氧化硅的217.4%。 AMMIOSXI-100表面分析仪表明,花形二氧化硅的表面粗糙度与球形二氧化硅的表面粗糙度相当。通过建立接触磨损模型,分析了花形二氧化硅磨料和蓝宝石晶片之间的实际接触面积较大,并且更加越来越大。该研究提供了一种制备不规则形状二氧化硅的新颖可行方法。

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