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Ab Initio Investigation on Cu/Cr Codoped Amorphous Carbon Nanocomposite Films with Giant Residual Stress Reduction

机译:Cu / Cr共掺杂非晶态纳米碳复合膜的从头算研究

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摘要

Amorphous carbon films (a-C) codoped by two metal elements exhibit the desirable combination of tribological and mechanical properties for widely potential applications, but are also prone to catastrophic failure due to the inevitable residual compressive stress. Thus far, the residual stress reduction mechanism remains unclear due to the insufficient understanding of the structure from the atomic and electronic scale. In this paper, using ab initio calculations, we first designed a novel Cu/Cr codoped a-C film and demonstrated that compared with pure and Cu/Cr monodoped cases, the residual stress in Cu/Cr codoped a-C films could be reduced by 93.6% remarkably. Atomic bond structure analysis revealed that the addition of Cu and Cr impurities in amorphous carbon structure resulted in the critical and significant relaxation of distorted Cu-C bond lengths. On the other hand, electronic structure calculation indicated a weak bonding interaction between the Cr and C atoms, while the antibonding interaction was observed for the Cu C bonds, which would play a pivot site for the release of strain energy. Those interactions combined with the structural evolution could account for the drastic residual stress reduction caused by Cu/Cr codoping. Our results provide the theoretical guidance and:desirable strategy to design and fabricate a new nanocomposite a-C films with combined properties for renewed applications.
机译:由两种金属元素共掺杂的非晶碳膜(a-C)在广泛的潜在应用中表现出理想的摩擦学和机械性能组合,但由于不可避免的残余压应力,也易于发生灾难性故障。到目前为止,由于对原子和电子尺度对结构的了解不足,残余应力的减小机制仍然不清楚。在本文中,我们从头计算,首先设计了一种新型的Cu / Cr共掺杂aC膜,并证明与纯掺杂和Cu / Cr单掺杂情况相比,Cu / Cr共掺杂aC膜的残余应力可以显着降低93.6%。 。原子键结构分析表明,在无定形碳结构中添加Cu和Cr杂质会导致严重扭曲的Cu-C键长松弛。另一方面,电子结构计算表明Cr和C原子之间的键合作用较弱,而Cu C键则观察到抗键作用,这将成为释放应变能的关键部位。这些相互作用与结构演变相结合,可以解释由于铜/铬共掺杂引起的残余应力的急剧降低。我们的结果为设计和制造具有结合特性的新型纳米复合a-C膜提供了理论指导和理想策略,以用于更新的应用。

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