CuO CuO Cu Fabrication of CuO Nanoparticles and Thereof Ink and Microwave-Irradiated Reduction of CuO Films into Metallic Cu films

摘要

The present invention relates to a composite of copper oxide (CuO) nanoparticles having a particle size of 2 ~ 20 nm. The present invention is the CuO nanoparticles, water, ethanol (Ethanol), it is to use a mixed solvent of ethylene glycol (Ethylene glycol) to a method for manufacturing the ink. The glycol is a reducing agent role. In addition, the present invention was prepared in a thin film on the substrate using a combination of CuO nanoparticles ink, and by microwave irradiation in different time intervals to form a pure copper film. When spin coating (Spin coated) with more than 3 minutes, the microwave irradiation in the published CuO 2 to 3 times the ink film has a higher resistance than 4.65 .cm bulk (bulk). The ink was printed on a variety of substrates by applying to jelpen. Printed on paper electrode substrate with an ink pen was tested three times in a row and has a resistance of printing and microwave 10 six times higher than the bulk. ;