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Synergistic combination of amorphous indium oxide with tantalum pentoxide for efficient electron transport in low-power electronics

机译:钽五氧化钽与低功率电子氧化钽的协同组合

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Among transparent metal oxide semiconductors, systems based on indium oxide currently deliver the best combination of electronic characteristics and optical transmittance, outperforming even the well-established polycrystalline silicon devices. Indium oxide has the unique property that uniform, amorphous films yield superior electronic properties compared to microcrystalline films; for this reason, Ga and Zn hetero-elements are usually added to disrupt crystallization and result in uniformly disordered films. However, dopants have a general tendency to increase the complexity and decrease the mobility of semiconductors and their addition might well be avoided if high-quality, amorphous In2O3 films could be grown without them. In this work, we show that this problem can be resolved by exploiting a synergistic interaction between solution-processed indium oxide (In2O3) and underlying tantalum pentoxide (Ta2O5) dielectric films. We observed that amorphous Ta2O5 inhibits crystallization of In2O3 leading to high-quality amorphous thin films with reduced oxygen deficiencies at the semiconductor/dielectric interface. Transparent Ta2O5/In2O3 TFTs with very low operating voltages were demonstrated with effective field-effect mobilities of up to 23.1 cm(2) V-1 s(-1) at only 3 V drain-source voltage (V-DS) using this approach. Additionally, the suppressed carrier density arising from reduced oxygen deficiencies reduced the drain current at 0 V gate bias (I-0) by six orders of magnitude from 0.25 mA to 10.8 nA, compared to a SiO2 reference device. These results highlight the importance of considering an underlying dielectric layer to maximize device performance.
机译:在透明金属氧化物半导体中,基于氧化铟的系统目前提供了电子特性和光学透射率的最佳组合,即使是良好的多晶硅器件也表现优于良好的多晶硅装置。氧化铟具有均匀的特性,与微晶膜相比,无定形膜产生优异的电子性能;因此,通常添加Ga和Zn杂元以破坏结晶并导致均匀无序的薄膜。然而,掺杂剂具有一般的趋势,可以提高复杂性并降低半导体的移动性,如果高质量,无定形的In2O3薄膜可以在没有它们的情况下生长它们的添加。在这项工作中,我们表明,通过利用溶液加工氧化铟(In2O3)和底丁氧化物(Ta2O5)介电膜之间的协同相互作用来解决该问题。我们观察到,无定形Ta2O5抑制了In2O3的结晶,导致高质量的非晶薄膜,在半导体/介电接口处减少氧气缺陷。具有非常低的工作电压的透明Ta2O5 / In2O3 TFT,使用该方法仅以3V漏极源电压(V-DS)高达23.1cm(2)V-1 S(-1)的有效现场效应迁移率。另外,与SiO 2参考装置相比,从降低的氧气缺陷引起的抑制载流子密度在0V栅极偏置(I-0)下将漏极电流从0.25 mA到10.8 NA从0.25 mA到10.8 NA的六个级。这些结果突出了考虑底层介电层以最大化设备性能的重要性。

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