Until now, grain boundaries in nanocrystalline copper films have been thought to be perpendicular to the material's surface. But new research shows that these grains are often rotated, forming ridges that cause surface roughness. This discovery is detailed in Nanocrystalline copper films are never flat by a team of researchers from AMBER, the Science Foundation Ireland-funded materials science centre based in Trinity College Dublin, Ireland, the University of Pennsylvania, USA, Imperial College London, UK, and the Intel Corporation Components Research Group, USA.
展开▼
